Physical vapor deposition (PVD) is a vaporization coating technique, involving the transfer of material from the Target, Source or Cathode on an atomic level under vacuum conditions.
The process involves four steps:
(i) evaporation of the material to be deposited by a high energy source such as an electron beam or ions–this evaporates atoms from the surface;
(ii) transport of the vapor to the substrate to be coated;
(iii) reaction between the metal atoms and the appropriate reactive gas (such as oxygen, nitrogen or methane) during the transport stage;
(iv) deposition of very thin & hard coatings such as Chromium nitride, Titanium Nitride etc. at the substrate surface.
The transportation step is through a plasma medium. Plasma is a collection of charged particles, whose constituents can be influenced by magnetic fields and tend to travel in straight lines or "line of sight" from source to substrate.
PVD has several advantages including:
(i) coatings formed by PVD may have improved properties compared to the substrate material;
(ii) all types of inorganic materials and some types of organic materials can be used;
(iii) the process is environmentally friendly compared to many other processes such as electroplating.
Besides its specific chemical constituents and the architecture of the sub-layers, the properties of a PVD coating depend on: ion energy; the degree of ionization of the metal ions, and mobility of the atoms condensing on the substrate surface. If a source material, such as a hydrocarbon gas, is used, a very hard, ultra low-friction Diamond-like-Carbon (DLC) coating can be deposited. This gas based process is referred to as PACVD - Plasma Assisted Chemical Vapor Deposition.
There is a broad range of available PVD technologies, including conventional arc deposition and magnetron sputtering, coupled with technology enhancements that yield high deposition rates and thin films with high adhesion and diverse microstructures. HEF PVD coatings are deposited using PEMS technology.
HEF patented PEMS is a magnetron sputtering process enhanced by an auxiliary plasma source. This triode system allows independent control of material flux, ion energy and substrate bias. PEMS can provide a multitude of high performance coatings with application customized hardness, density and toughness.
In a strong position because of this control of processes, the HEF Group has developed a series of coatings which cover a very wide area of thin layer applications: